CHIP’N’PLY – Modern binders for wood-based materials for modular construction
Project co-financed by the state budget. Project co-financed by a specific grant from the President of the Łukasiewicz Centre.
Acronym: CHIP'N'PLY
Type: R&D
Grant: PLN 190 400.00
Total value: PLN 238 000.00
Start date: 01.12.2021
Project completion date: 30.11.2022
Consortium members:
- Łukasiewicz Research Network – Institute of Heavy Organic Synthesis “Blachownia” (project leader)
- Łukasiewicz Research Network – Poznań Institute of Technology
The subject of the project is the development of modern wood-based materials for modular construction. The project comprises two main tasks: the first is to develop a method of obtaining an adhesive composition for plywood based on resol phenolic resin, in which the phenolic raw material will be partially replaced by lignin, while the second is to develop a binder for building particleboards in the form of formaldehyde-free melamine resins, which will be produced on the basis of chemical compounds less toxic than formaldehyde.
Contact:
Dominika Janiszewska, PhD Eng.
dominika.janiszewska@pit.lukasiewicz.gov.pl
Patrycja Hochmańska-Kaniewska, PhD Eng.
patrycja.hochmanska@pit.lukasiewicz.gov.pl
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